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Holger Schuehrer - Patents
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Inventors: Ralf Richter, Jens Heinrich, Holger Schuehrer (Globalfoundries Inc.) Contact optimization for enhancing stress transfer in ...
Globalfoundries Inc patent inventors (2012)
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Note: Some Globalfoundries Inc-related inventors may appear under alternate organization names/spellings. Inventors are ... Holger Schuehrer · Ina Ostermay.
MATTHIAS LEHR - Patents
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Inventors: Frank Kuechenmeister, Matthias Lehr (Globalfoundries Inc.) Inventors: Frank Koschinsky, Matthias Lehr, Holger Schuehrer
Ralf Richter - Patents
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Inventors: Ralf Richter, Jens Heinrich, Holger Schuehrer (Globalfoundries Inc.) Increasing robustness of a dual stress liner approach ...
Business-Profile
patentbuddy: Holger Schuehrer
GLOBALFOUNDRIES INC., Dresden, DE
Dokumente zum Namen
Holger Schuehrer - Academia.edu
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[PDF] 12. RENTA Oberelbe-Marathon Ergebnisliste AK - Free Download PDF
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Dr. Holger Schuehrer (67). Dresden. 3:38:44 GER Jens-Udo Wolf (67). X-Fab Dresden. 3:38:48 GER Carsten Abt (66). LT Hanau/Bruchköbel. › download › 12-renta-oberelbe-mar...
Sonstiges
US B2 - Method for removing a passivation layer prior to...
patents.google.com
By forming a thin passivation layer after the formation of openings connecting to a highly reactive metal region, any queue time effects may be...
WO A1 - Method and apparatus for reducing semiconductor...
patents.google.com
Download PDF Find Prior Art Similar. Other languages: English: French; Inventor: E. Todd Ryan: Holger Schuehrer: Seung-Hyun Rhee ... › patent
US B1 - Passivation of copper in dual damascene metalization...
patents.google.com
The present invention pertains to systems and methods for passivating the copper seed layer deposited in Damascene integrated circuit manufacturing. More...
12. RENTA Oberelbe-Marathon Ergebnisliste AK - PDF Free Download
docplayer.org
... Thomas Wetzig (68) Nischwitz 3:37:52 GER Ralf Patzer (67) Stadtparkschnacker Hamburg 3:37:56 GER Dr. Holger Schuehrer (67) Dresden 3:38:44 GER Jens-Udo Holger Schührer 289 km 510 km 437 km km 41,6 kg CO2 73,4 kg CO2 62,9 kg CO2 178,0 kg CO2 Globetrotter Ausrüstung Dresden Globetrotter Ausrüstung Dresden ... › renta-oberelbe-m... › Dresden-teilnehmeru...
CONTACT OPTIMIZATION FOR ENHANCING STRESS TRANSFER IN CLOSELY SPACED...
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CONTACT OPTIMIZATION FOR ENHANCING STRESS TRANSFER IN CLOSELY SPACED TRANSISTORS is an invention by Ralf Richter, Dresden GERMANY. This patent application was...
Result Details
marathonview.net
139, Lukas Niese · 4:21: , Michael Schulz-Fleuch · 4:21: , Frank Schulz · 4:21: , Dirk Gollnick · 4:23: , Holger Schuehrer · 4:24:43. › result
DE A1 - Verfahren und Halbleiterstruktur zur Überwachung...
patents.google.com
Durch Messen einer elektrischen Eigenschaft einer Testfläche, die mit mehreren Testkontaktdurchführungen verbunden ist, die gemäß einem spezifizierten...
DE B4 - Verfahren zum Erzeugen einer unterschiedlichen...
patents.google.com
Uitvinders, Kai Frohberg, Joerg Hohage, Matthias Schaller, Holger Schuehrer. Aanvrager, Advanced Micro Devices, Inc., Sunnyvale. Citatie exporteren, BiBTeX ...
US A1 - Oxidant and passivant composition and method for...
patents.google.com
A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic...
Relationship between microstructure and electromigration damage in...
www.semanticscholar.org
Semantic Scholar extracted view of
Symposium J | MRS Spring Meeting | San Francisco
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Symposium J: Materials Reliability in Microelectronics VII from the MRS Spring Meeting
VOID SEALING IN A DIELECTRIC MATERIAL OF A CONTACT LEVEL OF A...
www.patentsencyclopedia.com
Inventors: Ralf Richter (Dresden, DE) Kai Frohberg (Niederau, DE) Holger Schuehrer (Dresden, DE) IPC8 Class: AH01L2348FI USPC Class: ...
US B1 - Non-metallic barrier formation for copper damascene...
patents.google.com
A method for forming dual-damascene type conducting interconnects with non-metallic barriers that protect said interconnects from fluorine out-diffusion...
US B1 - Method for forming dual damascene opening
patents.google.com
A method for forming a dual damascene opening includes the following steps. Firstly, a first hard mask layer with a trench pattern is formed over a...
REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A...
www.patentsencyclopedia.com
Inventors: Holger Schuehrer (Dresden, DE) Juergen Boemmels (Dresden, DE) IPC8 Class: AH01L2348FI USPC Class: Class name: ...
REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES DURING BEOL...
www.patentsencyclopedia.com
Inventors: Matthias Lehr Frank Koschinsky Holger Schuehrer Agents: WILLIAMS, MORGAN & AMERSON Assignees: Origin: HOUSTON, TX US
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