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AKira Chinda - Patents
www.freshpatents.com
Recent bibliographic sampling of AKira Chinda patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):
Jazz Live at Khaosan Bar vol.7 ~ASABA TRIO~
www.wherevent.com
Saturday start 1st set 8 30pm 2nd set 9 30pm charge 1500yen including 1drink member Hirofumi Asaba Guitar Shinji ...
International Share House６３４ ｛ノマシェア東京支部｝ アジアンナイトVOL１
www.wherevent.com
Monthly Event for International house bar 634 Asian night Vol Freedom and encounters not found living alone For re...
Business-Profile
patentbuddy: Akira Chinda
NEC ELECTRONICS CORPORATION
Ausbildung
180 results in SearchWorks catalog
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Stanford Libraries' official online search tool for books, media, journals, databases, government documents and more.
IEICE Trans
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pp PAPER Advanced Trench Filling Process by Selective Copper Electrodeposition for Ultra Fine Printed Wiring Board Fabrication Hiroshi NAKANO Hitoshi SUZUKI Toshio HABA Hiroshi YOSHIDA Akira CHINDA Haruo AKAHOSHI · Summary | Full Text(in Japanese):PDF(634.1KB) ...
Bücher
Microelectronic Packaging - Google Books
books.google.se
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally,...
Dokumente zum Namen
Method for preparing integrated circuit modules for attachment to...
www.freepatentsonline.com
A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame...
Comparison of the Corrosion Behavior of Pure Fe, Ni, Cr, and Type
meridian.allenpress.com
ISAO SEKINE and AKIRA CHINDA *. Abstract. In order to investigate the chemical components which contribute to the corrosion resistance.
materials and components for flat panel display
123docz.net
high standard of display module craftsmanship. Masatoshi Shiiki. Junichi Imaizumi. Teruhisa Miyata. Akira Chinda, Dr. Eng. INTRODUCTION.
Veröffentlichungen allgemein
Microelectronic packaging | WorldCat.org
www.worldcat.org
Diesen Titel erhalten Sie in einer Bibliothek! Microelectronic packaging. [Madhav Datta; Tetsuya Ōsaka; J W Schultze;] --
Microelectronic packaging (E-Book, 2005) [WorldCat.org]
www.worldcat.org
Diesen Titel erhalten Sie in einer Bibliothek! Microelectronic packaging. [Madhav Datta; Tetsuya Saka; J W Schultze;]
Artikel & Meinungen
전자디바이스 탑재용 기판의 표면처리기술 : 네이버 블로그
prologue.blog.naver.com
... 부품으로 사용되기 때문에 전기적 특성이 가장 중요하다. 회로폭이 좁으면 저항이 증가하므로 저항의 증가를 억제해야 한다. 저자, Akira Chinda.
Sonstiges
US A1 - Electronic device substrate and its fabrication...
patents.google.com
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected...
US A1 - Wiring Board and Production Method Thereof...
patents.google.com
It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film...
Materials and Components for Flat Panel Display Applications - PDF...
docplayer.net
Materials and Components for Flat Panel Display Applications Masatoshi Shiiki Junichi Imaizumi Teruhisa Miyata Akira Chinda, Dr. Eng. OVERVIEW:
Chinda, JP - Patent applications
www.patentsencyclopedia.com
Chinda, JP. Akira Chinda, Hitachi JP. Patent application number, Description, Published , Wiring Board and Production Method Thereof - It is an object of ... Akira Chinda, Tokyo JP. Patent application number, Description, Published , Electronic device substrate and its fabrication method, and ...
Advanced trench filling process by selective copper electrodeposition...
www.infona.pl
more. less. Hiroshi Nakano, Hitoshi Suzuki, Toshio Haba, Hiroshi Yoshida, Akira Chinda, Haruo Akahoshi · Details · Authors · Bibliography · Quotations · Similar ...
Microelectronic packaging
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Découvrez et achetez Microelectronic packaging. Livraison en Europe à 1 centime seulement !
2016 NNT Conference - Poster program
www.nntconf.org
... Ltd. - Toshio Haba, Materials Research Lab, Hitachi Ltd. - Akira Chinda, Hitachi Cable Ltd. - Haruo Akahoshi, Materials Research Lab, Hitachi Ltd.
[PDF] Materials and Components for Flat Panel Display Applications |...
www.semanticscholar.org
Hitachi is committed to R&D aimed at improving the performance and reducing the cost of LCDs, plasma displays, and other lightweight flat-screen display...
hiroshi yoshida process
treinamento.ec
Hiroshi Yoshida Akira Chinda Copper was selectively and anisotropically electroplated for a resistless metallization process using copper overburden with an ...
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