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Boon Leong Lim - Patents - Collective IP
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Infineon Technologies AG. Bernd Goller, Markus Dinkel, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim. A semiconductor package including a leadframe having ...
Lim Boon Kian, Page 1 - Patentmaps
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Lee Teck Sim, Yong Wae Chet, Bernd Goller, Lim Boon Kian: Leadframe having mold lock vent. Infineon Technologies August 24, 2010: US (2 ...
Boon Kian Lim - Patents
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Infineon Technologies Ag Archived* (*May have ... Sorry, we were not able to pull up patent applications associated with Boon Kian Lim. It's possible that Boon ...
Boon Kian Lim, Inventor, Melacca, MY - Patent Buddy
www.patentbuddy.com
Boon Kian Lim's Inventor profile, Melacca, MY, INFINEON TECHNOLOGIES AG;, 6 patents/applications from Nov 30, to May 13, 2010, ...
Lim Boon Kian - Patents
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Recent bibliographic sampling of Lim Boon Kian patents listed/published in the public domain by the USPTO (USPTO Patent ... Infineon Technologies Ag
Lim, Melaka - Patent applications
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Top 100 Inventors. Top 100 Agents. Top 100 Assignees. Boon Kian Lim. MELAKA, MY ELECTRONIC DEVICE - Embodiments provide an electronic device ...
Boon Kian Lim - Inventor Patent Directory, Page 1 - IPEXL.com
patent.ipexl.com
Directory of patents invented by Boon Kian Lim (6 patents): Semiconductor package with ... Infineon Technologies June 18, 2013: US
Patente - Google
www.google.de
... Markus Dinkel, Wae Chet YONG, Teck Sim Lee, Boon Kian Lim. Ursprünglich Bevollmächtigter, Infineon Technologies Ag. Zitat exportieren, BiBTeX, EndNote, ...
Patente DE A1 - Elektronische Anordnung ...
www.google.com.br
Inventores, Yang Hong Muar Heng, Boon Kian Merlimau Lim. Requerente, Infineon Technologies Ag. Exportar citação, BiBTeX, EndNote, RefMan.
Patentes - Google
www.google.com.br
Inventores, Lee Teck Sim, Yong Wae Chet, Bernd Goller, Lim Boon Kian. Cessionário original, Infineon Technologies Ag. Exportar citação, BiBTeX, EndNote, ...
Lim Boon Kian, Page 1 - DirectoryPatent.com
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Lee Teck Sim, Yong Wae Chet, Bernd Goller, Lim Boon Kian: Leadframe having mold lock vent. Infineon Technologies August 24, 2010: US (2 ...
ArchPatent US Patent Search
www.archpatent.com
· ELECTRONIC DEVICE, Infineon Technologies AG · Semiconductor package with mold lock vent, Infineon Technologies AG
DiscoverIP Patents - US : Method of fabricating a semiconductor...
discoverip.cambridgeip.com
... Inventor(s): Bernd Goller, Markus Dinkel, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim; Assignee(s): Infineon Technologies AG; Primary Examiner: Zandra ...
Patents - Google
www.google.co.in
Inventors, Boon Kian Lim, Yang Hong Heng. Original Assignee, Infineon Technologies Owner name: INFINEON TECHNOLOGIES AG, GERMANY.
Patent US Leadframe having mold lock vent - Google Patents
www.google.im
A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a...
Patent US Electronic device having profiled elements...
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Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the...
Lim boon patents, pg. 3 | Patentfish.com
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Inventions related to lim boon, page 3. Related patent searches for lim boon are learning remote control, boon kiat, learning remote, lim boon, remote control,...
Patent scores for Leadframe having mold lock vent
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Lee Teck Sim; Yong Wae Chet; Bernd Goller; Lim Boon Kian ... Infineon Technologies AG ... More citations indicate that other technologies build on a patent.
Semiconductor package with mold lock vent - AnyPatents?
www.anypatents.com
... Date: June 8, 2010; Inventors: Bernd Goller · Markus Dinkel · Wae Chet Yong · Teck Sim Lee · Boon Kian Lim; Original Assignee: Infineon Technologies AG ...
SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT - patent
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A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major...
US Patent Issued to Infineon Technologies on June 18 for
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... was assigned to Infineon Technologies AG (Neubiberg, Germany) Sim Lee ( Malacca, Malaysia) and Boon Kian Lim (Melacca, Malaysia).
US B2 - Electronic device having profiled elements extending...
www.anypatents.com
Patent US B2. Type: Grant; Date: October 4, 2011; Inventors: Boon Kian Lim · Yang Hong Heng; Original Assignee: Infineon Technologies ...
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