Dr. Thorsten Matthias und Bonding - Info zur Person

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EV Group fields a 3D TSV package bonding machine | IT Eco Map & News...

itersnews.com

... critical steps to enabling the successful integration and implementation of 3D ICs into high-volume production," stated Dr. Thorsten Matthias, ...

EVG sells first ZoneBOND temporary bonding/debonding ...

www.semiconductor-today.com

— ... tape debonding, slide-off debonding and now ZoneBOND,” notes business development director Dr Thorsten Matthias. “EVG has provided TB/DB ... › ...

EV Group Pushes The Limits On 3D-IC Manufacturing For Next-Generation...

www.pressebox.com

EV Group - E. Thallner - Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding...

EV Group's ZoneBOND® Temporary Bonding/Debonding Technology, EV Group...

www.pressebox.com

EV Group - E. Thallner - Makes First Foray Into Compound Semiconductor Market

EV Group Adds In-Line Metrology Capability To Wafer Bonding System To...

www.metrologyworld.com

... cost of production," stated Dr. Thorsten Matthias, Business Development Director at EVG. "With our new integrated in-line metrology module, ...

Dow Corning and EV Group to collaborate on temporary bonding...

sst.semiconductor-digest.com

... Dow Corning is an important and much welcomed addition to our open temporary wafer bonding/debonding materials platform,” said Dr. Thorsten Matthias, ... › ...

EV Group Adds In-Line Metrology Capability to Wafer Bonding Systems...

siliconsemiconductor.net

Our selection of industry specific magazines cover a large range of topics.

Aligned Low Temperature Wafer Bonding for MEMS Manufacturing:...

www.cambridge.org

Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises - Volume 1052

3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding |...

www.cambridge.org

3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding - Volume Thorsten Matthias, Markus Wimplinger, Stefan Pargfrieder, Paul Lindner

3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer ...

www.cambridge.org

von T Matthias · · Zitiert von: 16 — 3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding. Published online by Cambridge University Press: 26 February Thorsten Matthias ,. › article

EV Group: Progress on Advanced C2W Bonding - 3D InCiteswww.3dincites.com ›

www.3dincites.com

· Chip Scale Review recently spoke with Thorsten Matthias, Business Development Director for EV Group, to learn more about the company's ...

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