Kai-Jens Matejat und Applicant - Info zur Person

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Full text of "Gazette of India, 2004, No. 517"

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DEUTSCHLAND KG Address of the Applicant: ESC HENHEIMER TOR , D BERLIN, GERMANY Name of the Inventors: ( (1) KAI-JENS MATEJAT (2) SVEN ...

EP A2 - Method to form solder deposits on substrates

patents.google.com

Inventors, Sven Lamprecht, Kai-Jens Matejat, Ingo Ewert, Stephen Kenny. Applicant, Atotech Deutschland GmbH. Export Citation, BiBTeX ...

WO A1 - Aqueous composition for etching of copper and copper...

patents.google.com

Applicant, Atotech Deutschland Gmbh ... US , Jun 7, 2004, Aug 10, 2006, Kai-Jens Matejat, Mehtod for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and ...

EP A1 - Method to form solder deposits and non-melting bump...

patents.google.com

Inventors, Kai-Jens Matejat, Sven Lamprecht, Ingo Ewert. Applicant, Atotech Deutschland GmbH. Export Citation, BiBTeX, EndNote, RefMan. Patent Citations ...

EP A1 - Method for metallization of solar cell substrates...

patents.google.com

Inventors, Dr. Torsten Voss, Kai-Jens Matejat, Jan Sperling, Sven Lamprecht, Catherine Schoenenberger. Applicant, ATOTECH Deutschland GmbH.

WO A2 - Method to form solder deposits on substrates...

patents.google.com

... Kai-Jens Matejat. Applicant, Atotech Deutschland Gmbh. Cited Patent Filing date Publication date Applicant WO A1 7 Oct Apr Atotech Deutschland Gmbh EP A1 15 Mar Sep Atotech Usa, Inc

WO A1 - Process for filing micro-blind vias

patents.google.com

Inventors, Herko Genth, Oswald Igel, Kai-Jens Matejat, Akif Oezkoek, Bernd Ottmar Roelfs. Applicant, Atotech Deutschland Gmbh, Herko Genth, Oswald Igel, ...

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Name "Matejat" (6)

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Kai-Jens Matejat und Applicant Person-Info