Klaus Pressel und Integration - Info zur Person

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ESTC : 3rd Electronic System-Integration Technology ...

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Chair: Klaus Pressel, Infineon, Germany Co-Chair: Gilles Poupon, CEA-LETI, France * Advanced packaging involving new materials › servlet

Antenna-in-Package Technology and Applicationsgoogle.de

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... , Inc. k k Antenna Integration in eWLB Package k k k k Antenna Integration in eWLB Package Maciej Wojnowski and Klaus Pressel Introduction.

Handbook of Silicon Based MEMS Materials and Technologies - Google...

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Deposition Rob N. Candler and Paul M. Hagelin Dicing of MEMS Devices Devin Martin and Scott Sullivan 3D Integration of MEMS Horst Theuss and Klaus Pressel Via Technologies for MEMS Pradeep Dixit and Kimmo Henttinen Outgassing ...

Advanced Packaging ForumSmart Abstract

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by Thorsten Meyer and Klaus Pressel. Infineon Technologies AG, Regensburg. Heterogeneous Integration is a major technology driving force for microelectronic ...

Chapter D Integration of MEMSScienceDirect

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von H Theuss · · Zitiert von: 4 — ... Technologies. Chapter D Integration of MEMS. Author links open overlay panel. Horst Theuss , Klaus Pressel. Show more. Outline. Add to Mendeley. Share.

Packaging Standard - an overview | ScienceDirect Topics

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3D Integration of MEMS. Horst Theuss, Klaus Pressel, in Handbook of Silicon Based MEMS Materials and Technologies (Second Edition),

Details der Publikation - "3D Integrationsplattform für zukünftige...

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... characterization and application potential / Autoren: Klaus Pressel, Matthias Reinwald und Stephan Pindl ; Infineon Technologies AG. Buchumschlag.

Technical Program Committee - ESTCElectronics System-Integration Technology Conference

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Advanced Packaging Subcommittee. Chair: Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany. Co-Chair: Klaus Pressel, Infineon Technologies AG, Germany. Members ...

Advanced Packaging Conference (APC)

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Webby Thorsten Meyer and Klaus Pressel. Infineon Technologies AG, Regensburg Heterogeneous Integration is a major technology driving force for microelectronic …

IEEE International 3D System Integration Conference 2011

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Klaus Pressel (Infineon Regensburg) . Ric van Doremalen (Philips Eindhoven) › ...

Chapter Overview I: Articles

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WebKlaus Pressel, Gottfried Beer, Bernd Römer Coming Challenges for Silicon Interposers 216 Gilles Poupon, Charles Fort Challenges in 3D Integration, Assembly and Test …