Markus Bschorr und Technology - Info zur Person

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Handbook of 3D Integration, Volume 1: Technology and Applications of...

books.google.co.uk

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the...

Interconnect Technology for Three-dimensional Chip Integration -...

books.google.com.au

... München, for their support on work coordination and access to Infineon resources, Alexander Kaiser, Peter Benkart and Markus Bschorr, the members of our 3D-research team at the University of Ulm. Countless discussions through all ups and downs of semiconductor technology and its pitfalls welded together this team, ...

On the Construction of Artificial Brains - Google Books

books.google.com.au

16: Alexander Kaiser, Andreas Munding and Peter Benkart under the guidance of Prof. Kohn and Markus BSchorr under the guidance of Prof. Pfleiderer have successfully developed and tested the individual processing steps of the 3D integration; essential contributions to the 3D stacking technology presented here are due ...

Parallelisierung von Algorithmen zur Nutzung auf Architekturen mit...

books.google.com.au

Implementing simd in software. INSIDE DSP, June [BKM+05] Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Joerg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, and Ulrich Ramacher. 3d chip stack technology using through-chip inter- connects. IEEE Des. Test, 22(6):512–518, ...

Alexander Kaiser
Erhard Kohn
Markus Buck

Monika Endt
Axel Straub
Björn Andres

Person "Bschorr" (1)
Vorname "Markus" (61377)
Name "Bschorr" (71)

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Markus Bschorr und Technology Person-Info

Handbook of 3D Integration, Volume 1: Technology and Applications of...

Interconnect Technology for Three-dimensional Chip Integration -...

On the Construction of Artificial Brains - Google Books

Parallelisierung von Algorithmen zur Nutzung auf Architekturen mit...

3D Chip Stack Technology Using Through-Chip Interconnects | IEEE ...

3-D Chip Integration Technology for Microsystems

3D chip stack technology using through-chip interconnects ...

Alexander Kaiser - researchr alias

Alle Infos zum Namen "Markus Bschorr"