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QDPAK- und DDPAK-Gehäuse mit Top-Side-Kühlung von Infineon ...www.ctrl-tec.de › archiv › qdpak-und-ddpak-gehaeuse-mit-top-side-kuehl...
www.ctrl-tec.de
AH · ... sagt Ralf Otremba, Lead Principal Engineer für High Voltage Packaging bei Infineon. „Unsere fortschrittlichen,Top-Side-gekühlten Gehäuse ...
Startseite - Sportverein Merkenfritz e.V.www.sv-merkenfritz.de › ...
www.sv-merkenfritz.de
AH · ... Edgar Maul, Leon Förnges, Marius Weber, Maximilian Förnges, Michel Thaden, Ralf Otremba, Sebastian Otremba, Stefan Dinges (Beisitzer)
英飛凌適合高功率應用的QDPAK 和DDPAK 頂部冷卻封裝註冊為 ...www.wpgdadatong.com › productnews › detail
www.wpgdadatong.com
AH · 英飛凌高電壓封裝首席工程師Ralf Otremba 表示：「身為解決方案供應商，英飛凌持續透過創新的封裝技術和製程，對半導體產業發揮影響力。
Netzwerk-Profile
Interessen
Ralf Otremba - Patents
www.freshpatents.com
Ralf Otremba patents. Recent bibliographic sampling of Ralf Otremba patents listed/published in the public domain by the USPTO (USPTO Patent Application # ...
Infineon Technologies Ag patent inventors (2013)
stks.freshpatents.com
Rainer Steiner · Ralf Otremba · Ralf Wombacher · Ram Asra · Ramgopal Rao · Ramgopal Rao · Reimund Engl · Reinhard Feger · Reinhard-wolfgang Jungmaier.
Business-Profile
patentbuddy: Ralf Otremba
INFINEON TECHNOLOGIES AG, Kaufbeuren, DE
Ralf Otremba Infineon Technologies · Power & Sensor Systems (PSS)www.researchgate.net › Infineon Technologies
www.researchgate.net
Ralf Otremba currently works at Power & Sensor Systems (PSS), Infineon Technologies. Ralf does research in Electronic Engineering.
Ausbildung
Alumni - Photonics and Optoelectronics Group - LMU Munich
www.phog.physik.uni-muenchen.de
Alumni. Former Postdocs; Former PhD-students; ... Ralf Otremba: "Untersuchungen zur raumzeitlichen Dynamik optischer Nichtlinearitäten in Halbleiterquantenfilmen"
Alumni - Photonics and Optoelectronics Group - LMU Munichwww.phog.physik.lmu.de › people › alumni
www.phog.physik.lmu.de
... Matthias Neges: "Zur Dynamik des Ladungsträgertransfers in organischen photovoltaischen Bauelementen"; Ralf Otremba: "Untersuchungen zur raumzeitlichen ...
Bücher
Ulrich Wachter | Infineon Technologies | Related Authors - Typeset.iotypeset.io › Author Directory
typeset.io
23 papers, 223 citations. 97% related. Klaus Schiess papers, 451 citations. 95% related. Ralf Otremba papers, 2K citations. 94% related ...
Silicon Carbide, Volume 2: Power Devices and Sensorsbooks.google.com.sa › books
books.google.com.sa
... Marion Hoja, Gerhard Hultsch, Thomas Scherg, Ralf Otremba, Dethard Peters, Rudolf Elpelt, Michael Treu, and Alexander Heinrich for their support.
Silicon Carbide, Volume 2: Power Devices and Sensors - Google Books
books.google.de
Silicon Carbide - this easy to manufacture compound of silicon and carbon is said to be THE emerging material for applications in electronics. High thermal...
Veröffentlichungen allgemein
Entscheidungsprotokoll TEIL A TEIL B - Gemeinde Hirzenhainwww.yumpu.com › document › view › entscheidungsprotokoll-teil-a-teil-b...
www.yumpu.com
AH · 3) Ralf Otremba. 4) Sarah Otremba. 5) Thomas Loos. 6) Stefan Merz. 7) Eric Müller (ab 19:45).
Gemeinde Hirzenhain - Entscheidungsprotokoll - YUMPUwww.yumpu.com › document › view › entscheidungsprotokoll-gemeinde-...
www.yumpu.com
AH · 3) Ralf Otremba. 4) Sarah Otremba (ab 19:45 Uhr). 5) Thomas Loos. 6) Eric Müller. 7) Mario Müller.
Artikel & Meinungen
Twitter-Nachrichten: Fabian Schiffer on Twitter: "Innovator of the year, category analog ...twitter.com › fabian_schiffer › status
AH · Innovator of the year, category analog and powermanagment IC: Ralf Otremba for DDPAK of . @Infineon. . #IdJ Image. 6:06 PM · Oct 24, ...
Sonstiges
Chip scale surface mounted device and process of manufacturewww.google.com.lb › patents
www.google.com.lb
US A1 * Ralf Otremba Semiconductor Device Comprising A Vertical Semiconductor Component And Method For Producing The Same.
Electronic Component and Method - Google Patentspatents.google.com › patent
patents.google.com
AH · US A1 * Ralf Otremba Electrically Conductive Connection, Electronic Component and Method for Their ...
Method and system for co-packaging vertical gallium nitride power ...www.google.sr › patents
www.google.sr
US A1 * Ralf Otremba Electronic Device. US A1 * International Rectifier Corporation ...
Ralf Otremba Archives | eBOMwww.ebom.com › tag › ralf-otremba
www.ebom.com
Ralf Otremba · Infineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications · X-Series Videos ...
Ralf Otremba, Kaufbeuren DE - Patent applications
www.patentsencyclopedia.com
Ralf Otremba, Kaufbeuren DE. Ralf Otremba, Kaufbeuren DE Patent applications by Ralf Otremba, Kaufbeuren DE
Browse Patents Invented by - Hans-Joachim Schulze - Trademark Elitewww.trademarkelite.com › patent › patent-inventor
www.trademarkelite.com
1018 records · RALF OTREMBA. KAUFBEUREN. GERMANY. HANS-JOACHIM SCHULZE. TAUFKIRCHEN. GERMANY. Publication. Application# Filed On:
Otremba - Names Encyclopedia
www.namespedia.com
Ralf Otremba (1) Reiner Otremba (1) Reinhold Otremba (1) Ken Otremba (1) Katja Otremba (1) Hannelore Otremba (1) Hartmut Otremba (1) Hedi Otremba (1) Hedwig …
Otremba Namensbedeutung und -herkunft - Namespediade.namespedia.com › details › Otremba
de.namespedia.com
Ralf Otremba (1) Reiner Otremba (1) Reinhold Otremba (1) Ken Otremba (1) Katja Otremba (1) Hannelore Otremba (1) Hartmut Otremba (1) Hedi Otremba (1)
Semiconductor Die Packages Having Overlapping Dice, System ...google.com › patents
google.com
AH · US A1 * Ralf Otremba Electronic Component and a Method for its Production. Family To Family Citations.
US A - Flat multiple-chip module micro ball grid array...
patents.google.com
... electronic apparatus, and method of manufacturing semiconductor device. US *, 10 apr 2007, 16 okt 2008, Ralf Otremba, Multi-Chip Module ...
US B2 - Semiconductor device including semiconductor chips...
patents.google.com
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer arranged over the carrier and...
Characterization and modeling of the AuSnCu thin solder joint under ...pure.unileoben.ac.at › publications › characterization-and-modeling-of-the...
pure.unileoben.ac.at
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. Thomas Antretter, Ralf Otremba, Balamurugan Karunamurthy, ...
Diventano standard JEDEC i package SMD top-side QDPAK e ...www.elettronicaemercati.it › AZIENDE
www.elettronicaemercati.it
AH · ... packaging e processi di produzione innovativi”, ha affermato Ralf Otremba, Lead Principal Engineer for High Voltage Packaging, Infineon.
EuroSimE in Gentwww.eurosime.org › index.php › gent
www.eurosime.org
Tiphaine Pélisset 1, Balamurugan Karunamurthy 1, Ralf Otremba 2, Thomas Antretter 3 1 KAI GmbH – Kompetenzzentrum Automobil- und Industrieelektronik, ...
Ex Parte Otremba et al, | Casetextcasetext.com › admin-law › ex-parte-otremba-et-al-1
casetext.com
AH · FILING DATE FIRST NAMED INVENTOR , Ralf Otremba MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES ...
Gemeindevertretung - Unabhängige Wählergemeinschaft Hirzenhainwww.uwg-hirzenhain.com › alles-über-uns › gemeindevertretung
www.uwg-hirzenhain.com
Stellvertretender Fraktionsvorsitzender. Ralf Otremba Hirzenhain Vorsitzender der Gemeindevertretung. Marko Heun ...
Gemeindewahl - Kommunalwahl in der Gemeinde Hirzenhainvotemanager-da.ekom21cdn.de › html5 › Gemeindewahl_Hessen_516_Ge...
votemanager-da.ekom21cdn.de
AH · Ralf Otremba, UWG, 511, %. Nicole Seitz, UWG, 390, %. Michael Höhl, UWG, 491, %. Jan-Erik Herche, UWG, 442, %.
Infineon announces registration of its QDPAK and DDPAK packages ...www.semimedia.cc › ...
www.semimedia.cc
AH · ... packaging technologies and manufacturing processes,” said Ralf Otremba, Lead Principal Engineer for High Voltage Packaging, Infineon.
- University of Leoben research gateway
pure.unileoben.ac.at
author = "Thomas Antretter and Ralf Otremba and Balamurugan Karunamurthy and Tiphaine Pélisset",. year = "2014",. isbn = " ",. booktitle ...
Infineon's QDPAK and DDPAK Top cooling packages suitable for ...www.heisener.com › TechnologyDetail › Infineon-s...
www.heisener.com
AH · ... innovative packaging technologies and processes," said Ralf Otremba, chief engineer of High voltage packaging at Infineon Technologies.
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