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Modellbildung für das Ultraschall-Draht…n Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig und Tobias Meyer Um eine modellbasierte ...
Zusammenfassung | springerprofessional.de
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Authors: Andreas Unger, Matthias Hunstig, Michael Brökelmann, Tobias Meyer, Simon Althoff, Olaf Kirsch, Reinhard Schemmel. Publisher: Springer Berlin ...
Experimental and Numerical Simulation Study of Pre-deformed ...meridian.allenpress.com › ism › article-pdf › isom-tp44
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Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...
Zusammenfassung (bibtex)
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Zusammenfassung (bibtex). by Andreas Unger, Matthias Hunstig, Michael Brökelmann, Tobias Meyer, Simon Althoff, Olaf Kirsch, Reinhard Schemmel.
Kupferbondverbindungen intelligent herstellen
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... pages={512–519} }. Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter …tro, Matthias Hunstig, Florian Biermann, and Karsten Guth.
Modeling and simulation of the ultrasonic wire bonding process
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Meyer, Tobias, Andreas Unger, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the ...
Experimental and Numerical Simulation Study of Pre- ...Hesse GmbH
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von A Unger · Zitiert von: 14 — Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...
Effects of different working frequencies on the joint formation in...
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by Reinhard Schemmel, Simon Althoff, Michael Brökelmann, Andreas Unger, ... Reinhard AND Simon Althoff AND Michael {Br{\"o}kelmann} AND Andreas Unger ...
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Intelligente Herstellung zuverlässiger ...
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Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig, Tobias Meyer. Kapitel 4. Simulation und Validierung des Bondprozesses. Zusammenfassung. Die am häufigsten genutzten Verfahren zur Prüfung einer Drahtbondverbindung sind sog. Pull-und Schertests.
tobi-meyer.de - Dr.-Ing. Tobias Meyer
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Es bildet dabei den Prozess von der Dynamik der mechanisch bei etwa 60 kHz schwingenden Sonotrode bis hin zum Verbindungsaufbau in der Kontaktfläche ab. Dieses Modell habe ich gemeinsam mit Andreas Unger, Paul Eichwald und Simon Althoff, alle Universität Paderborn, Lehrstuhl für Mechatronik und Dynamik, Dr.-Ing.
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online...
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@INPROCEEDINGS{Meyer2016, howpublished = {Conference Proceedings}, author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter ...
Effects of different working frequencies on the joint formation in ...
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Web@INPROCEEDINGS{Schemmel2018, author = {Schemmel, Reinhard AND Simon Althoff AND Michael {Br{\"o}kelmann} AND Andreas Unger AND Matthias Hunstig AND …tro, …
Analysis Method of Tool Topography Change and Identification of Wear...
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by Paul Eichwald, Walter …tro, Simon Althoff, Florian Ea…, Andreas Unger, Tobias Meyer, Karsten Guth. Abstract: Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the ...
Improving the cleaning process in copper wire bonding by …
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Webby Simon Althoff, Andreas Unger, Walter …tro, Florian Ea…. Abstract: Changing manufacturing technologies or material in well-known processes has to be followed by an …
Data-driven Modeling of the Ultrasonic Softening Effect for Robust...
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Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding ... by Andreas Unger, Walter …tro, Simon Althoff, Tobias Meyer, Michael Brökelmann, Klaus Neumann, René Felix Reinhart ... the physical modeling of the ultrasonic softening effect is notoriously difficult because of its highly non-linear character and the ...
Modeling and Simulation of the ultrasonic wire bonding process …
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Web@INPROCEEDINGS{Meyer2015b, author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter …tro AND Michael Br{\"o}kelmann AND Matthias Hunstig …
Shape-Dependent Transmittable Tangential Force of Wire …
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Web@INPROCEEDINGS{Althoff2016, author = {Simon Althoff AND Tobias Meyer AND Andreas Unger AND Walter …tro AND Florian Ea…}, title = {Shape-Dependent …
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to...
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Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear (bibtex) by Andreas Unger, Walter …tro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Ea…, Michael Brökelmann, Matthias Hunstig, Karsten Guth. Abstract:
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools...
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@INPROCEEDINGS{Althoff2016, howpublished = {Conference Proceedings}, author = {Simon Althoff AND Tobias Meyer AND Andreas Unger AND Walter …tro AND Florian Ea…}, title = {Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, booktitle = {IEEE 66th Electronic Components and Technology Conference}, year = {
Data-driven Modeling of the Ultrasonic Softening Effect for Robust ...www.tobi-meyer.de › bibtexbrowser
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by Andreas Unger, Walter …tro, Simon Althoff, Tobias Meyer, ... author = {Andreas Unger AND Walter …tro AND Simon Althoff AND Tobias Meyer AND Michael ...
Modellbildung für das Ultraschall-Draht…n ...www.springerprofessional.de › modellbildung-fuer-das...
Autoren: Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig, Tobias Meyer. Verlag: Springer Berlin Heidelberg. Erschienen in: Intelligente ...
Kupferbondverbindungen intelligent herstellen (bibtex)
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by Michael Brökelmann, Andreas Unger, Tobias Meyer, Simon Althoff, Walter …tro, Matthias Hunstig, Florian Biermann, Karsten Guth. Abstract:.
Modellbildung für das Ultraschall-Draht…n (bibtex)
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by Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig, Tobias Meyer. View PDF. Reference: Unger, A.; Althoff, S.; Brökelmann, M.; Hunstig, M.
Modeling and Simulation of the ultrasonic wire bonding ...www.tobi-meyer.de › bibtexbrowser
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by Tobias Meyer, Andreas Unger, Simon Althoff, Walter …tro, Michael ... author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter …tro ...
Validated Simulation of the Ultrasonic Wire Bonding Process (bibtex)
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by Andreas Unger, Reinhard Schemmel, Tobias Meyer, Florian Ea…, Paul Eichwald, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, ...
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