Simon Althoff und Paul Eichwald - Info zur Person

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Experimental and Numerical Simulation Study of Pre-deformed ...meridian.allenpress.com › ism › article-pdf › isom-tp44

meridian.allenpress.com

Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...

Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to...

ris.uni-paderborn.de

Unger, Andreas, Walter …tro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Ea…, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In th Electronics Packaging Technology Conference,

Experimental and Numerical Simulation Study of Pre- ...Hesse GmbH

www.hesse-mechatronics.com

von A Unger · Zitiert von: 14 — Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...

tobi-meyer.de - Dr.-Ing. Tobias Meyer

www.tobi-meyer.de

Es bildet dabei den Prozess von der Dynamik der mechanisch bei etwa 60 kHz schwingenden Sonotrode bis hin zum Verbindungsaufbau in der Kontaktfläche ab. Dieses Modell habe ich gemeinsam mit Andreas Unger, Paul Eichwald und Simon Althoff, alle Universität Paderborn, Lehrstuhl für Mechatronik und Dynamik, Dr.-Ing.

Multi-dimensional Ultrasonic Copper Bonding – New Challenges for ...www.semanticscholar.org › paper

www.semanticscholar.org

Paul Eichwald, Simon Althoff, +4 authors. M. Hunstig; Published 3 November 2017; Materials Science, Engineering. Abstract In power electronics, ...

Influences of Bonding Para… on the Tool Wear for …

www.bing.com

Web@INPROCEEDINGS{Eichwald2013, author = {Paul Eichwald AND Walter …tro AND Simon Althoff AND Florian Ea… AND Mark Schnietz AND Karsten Guth AND Michael …

Analysis Method of Tool Topography Change and Identification of Wear...

www.tobi-meyer.de

by Paul Eichwald, Walter …tro, Simon Althoff, Florian Ea…, Andreas Unger, Tobias Meyer, Karsten Guth. Abstract: Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the ...

Validated Simulation of the Ultrasonic Wire Bonding Process

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WebUnger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Ea…, Paul Eichwald, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. …

Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to...

www.tobi-meyer.de

Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear (bibtex) by Andreas Unger, Walter …tro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Ea…, Michael Brökelmann, Matthias Hunstig, Karsten Guth. Abstract:

Validated Simulation of the Ultrasonic Wire Bonding Process (bibtex)

www.tobi-meyer.de

by Andreas Unger, Reinhard Schemmel, Tobias Meyer, Florian Ea…, Paul Eichwald, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, ...

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Simon Althoff und Paul Eichwald Person-Info