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Intelligente Herstellung zuverlässiger ...google.com
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Modellbildung für das Ultraschall-Draht…n Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig und Tobias Meyer Um eine modellbasierte ...
Experimental and Numerical Simulation Study of Pre-deformed ...meridian.allenpress.com › ism › article-pdf › isom-tp44
meridian.allenpress.com
Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...
Modeling the ultrasonic softening effect for robust copper wire ...neuralautomation.de
von A Unger · Zitiert von: 2 — Simon Althoff, Tobias Meyer. Faculty of Mechanical Engineering. University of Paderborn. -49, Paderborn, Germany. Michael Brökelmann.
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to...
ris.uni-paderborn.de
Unger, Andreas, Walter …tro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Ea…, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In th Electronics Packaging Technology Conference,
Kupferbondverbindungen intelligent herstellen
ris.uni-paderborn.de
... pages={512–519} }. Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter …tro, Matthias Hunstig, Florian Biermann, and Karsten Guth.
Experimental and Numerical Simulation Study of Pre- ...Hesse GmbH
www.hesse-mechatronics.com
von A Unger · Zitiert von: 14 — Andreas Unger 1, Walter …tro 1, Simon Althoff 1, Paul Eichwald 1, Tobias Meyer 1, Florian Ea… 1. Michael Brökelmann 2, Matthias Hunstig 2, ...
tobi-meyer.de - Dr.-Ing. Tobias Meyer
www.tobi-meyer.de
Es bildet dabei den Prozess von der Dynamik der mechanisch bei etwa 60 kHz schwingenden Sonotrode bis hin zum Verbindungsaufbau in der Kontaktfläche ab. Dieses Modell habe ich gemeinsam mit Andreas Unger, Paul Eichwald und Simon Althoff, alle Universität Paderborn, Lehrstuhl für Mechatronik und Dynamik, Dr.-Ing.
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online...
www.tobi-meyer.de
@INPROCEEDINGS{Meyer2016, howpublished = {Conference Proceedings}, author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter ...
Modeling and Simulation of the ultrasonic wire bonding process …
www.bing.com
Web@INPROCEEDINGS{Meyer2015b, author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter …tro AND Michael Br{\"o}kelmann AND Matthias Hunstig …
Analysis Method of Tool Topography Change and Identification of Wear...
www.tobi-meyer.de
by Paul Eichwald, Walter …tro, Simon Althoff, Florian Ea…, Andreas Unger, Tobias Meyer, Karsten Guth. Abstract: Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the ...
Shape-Dependent Transmittable Tangential Force of Wire …
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Web@INPROCEEDINGS{Althoff2016, author = {Simon Althoff AND Tobias Meyer AND Andreas Unger AND Walter …tro AND Florian Ea…}, title = {Shape-Dependent …
Data-driven Modeling of the Ultrasonic Softening Effect for Robust...
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Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding ... by Andreas Unger, Walter …tro, Simon Althoff, Tobias Meyer, Michael Brökelmann, Klaus Neumann, René Felix Reinhart ... the physical modeling of the ultrasonic softening effect is notoriously difficult because of its highly non-linear character and the ...
Validated Simulation of the Ultrasonic Wire Bonding Process
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WebUnger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Ea…, Paul Eichwald, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. …
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to...
www.tobi-meyer.de
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear (bibtex) by Andreas Unger, Walter …tro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Ea…, Michael Brökelmann, Matthias Hunstig, Karsten Guth. Abstract:
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools...
www.tobi-meyer.de
@INPROCEEDINGS{Althoff2016, howpublished = {Conference Proceedings}, author = {Simon Althoff AND Tobias Meyer AND Andreas Unger AND Walter …tro AND Florian Ea…}, title = {Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, booktitle = {IEEE 66th Electronic Components and Technology Conference}, year = {
Data-driven Modeling of the Ultrasonic Softening Effect for Robust ...www.tobi-meyer.de › bibtexbrowser
www.tobi-meyer.de
by Andreas Unger, Walter …tro, Simon Althoff, Tobias Meyer, ... author = {Andreas Unger AND Walter …tro AND Simon Althoff AND Tobias Meyer AND Michael ...
Kupferbondverbindungen intelligent herstellen (bibtex)
www.tobi-meyer.de
by Michael Brökelmann, Andreas Unger, Tobias Meyer, Simon Althoff, Walter …tro, Matthias Hunstig, Florian Biermann, Karsten Guth. Abstract:.
Modellbildung für das Ultraschall-Draht…n (bibtex)
www.tobi-meyer.de
by Andreas Unger, Simon Althoff, Michael Brökelmann, Matthias Hunstig, Tobias Meyer. View PDF. Reference: Unger, A.; Althoff, S.; Brökelmann, M.; Hunstig, M.
Modeling and Simulation of the ultrasonic wire bonding ...www.tobi-meyer.de › bibtexbrowser
www.tobi-meyer.de
by Tobias Meyer, Andreas Unger, Simon Althoff, Walter …tro, Michael ... author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter …tro ...
Validated Simulation of the Ultrasonic Wire Bonding Process (bibtex)
www.tobi-meyer.de
by Andreas Unger, Reinhard Schemmel, Tobias Meyer, Florian Ea…, Paul Eichwald, Simon Althoff, Walter …tro, Michael Brökelmann, Matthias Hunstig, ...
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