Mario Kupnik - Veröffentlichungen allgemein

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Advances in Acoustic Sensing, Imaging, and Signal Processing

www.hindawi.com

Advances in Acoustic Sensing, Imaging, and Signal Processing. Jafar Saniie | Mario Kupnik | Erdal Oruklu. 06 Sep 2012; PDFDownload PDF · CitationDownload ... › aav

A Reconfigurable Haptic Joystick Based on Magneto-Rheological...

link.springer.com

Haptic interfaces with reconfigurable characteristics such as joysticks promise new possibilities for interaction design with increased intuitivity, new...

PhD position at Heidelberg University (Germany) within the Research...

bio-mechanik.org

— Sebastian Wolf (PI), Mario Kupnik (Co-PI), Frauke Nees (Co-PI). For further details feel free to contact the PI: ... › wordpress

hoch3 # by TU Darmstadt - Issuu

issuu.com

Katharina Immekus, Professorin im Fachbereich Architektur Dr. Mario Kupnik, Professor im Fachbereich Elektrotechnik und Informationstechnik Dr. Orsola ... › tu_darmstadt › docs › hoch3_2015_2

Bewegungsakademie [Institut für Sportwissenschaft]

wiki.ifs-tud.de

... Linda Brodhag, Mareike Schwed, Rainer Kollmar. Martin Puttke, Patrick Rump, Mario Kupnik, Roger Russel, Mareike Gooßes, Dirk Balfanz, Klaus Willimczik ... › ... › Aktuelle Themen

Published Special Issues | Advances in Acoustics and Vibration |...

www.hindawi.com

Advances in Acoustics and Vibration published special issues feature collections of articles based around a common theme, author or event

MEMS Materials and Processes Handbook | SpringerLink

link.springer.com

von R Ghodssi · Zitiert von: 315 — Shawn J. Cunningham, Mario Kupnik. Pages MEMS Packaging Materials. Ann Garrison Darrin, Robert Osiander. Pages › book

Test-driven Development to Overcome Challenges in the ...

www.designsociety.org

von J Peters · — ... Felix Herbst (2), Claas Hartmann (2), Romol Chadda (2), David Riehl (3), Ferdinand Keil (3), Mario Kupnik (2), Klaus Hofmann (3), Sven Matthiesen (1) › Te...

Three-Dimensional Acoustic Source Mapping with Different Beamforming...

www.hindawi.com

Acoustic source mapping techniques using acoustic sensor arrays and delay-and-sum beamforming techniques suffer from bad spatial resolution at...

Wafer Bonding | SpringerLink

link.springer.com

Wafer bonding is an integral part of the fabrication of MEMS, optoelectronics, and heterogeneous wafer stacks, including silicon-on-insulator. Wafer bonding...

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Veröffentlichungen allgemein Mario Kupnik